Inventor

LAI YI-SHAO

TW22 patents

⚠️ This page may combine multiple inventors who share the name “LAI YI-SHAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAI YI-SHAO

ADVANCED SEMICONDUCTOR ENG

Semiconductor package and method for processing and bonding a wire

Bonding strength testing device

Semiconductor package and manufacturing method thereof

Bonding strength measuring device

Chip packaging process

Chip package structure and chip packaging process

Tenon-and-mortise packaging structure

Semiconductor package having a trench penetrating a main body

Chip structure and stacked chip package as well as method for manufacturing chip structures

Semiconductor package

Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package

Tensile test method

CHANG HSIAO-CHUAN

Semiconductor device package having a buffer structure and method of fabricating the same

Semiconductor package

Semiconductor device package having a jumper chip and method of fabricating the same

LAI YI-SHAO

Semiconductor package and method for making the same

Semiconductor package having proximity communication signal input terminals and manufacturing methods thereof

Apparatus and method for testing non-contact pads of a semiconductor device to be tested

CHEN CHIEN-WEN

Advanced quad flat no lead chip package having a protective layer to enhance surface mounting and manufacturing methods thereof

CHANG HSIAO CHUAN

Wafer and semiconductor package

CHENG MING-HSIANG

Semiconductor device package

HUNG CHANG YING

Semiconductor package and method for packaging a semiconductor package