Inventor
CHANG HSIAO-CHUAN
TW16 patents
⚠️ This page may combine multiple inventors who share the name “CHANG HSIAO-CHUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
6 patentsUS8053906B2Nov 8, 2011
Semiconductor package and method for processing and bonding a wire
ADVANCED SEMICONDUCTOR ENG32 citations90
US9618191B2Apr 11, 2017
Light emitting package and LED bulb
ADVANCED SEMICONDUCTOR ENG2 citations72
US7980757B2Jul 19, 2011
Bonding strength measuring device
ADVANCED SEMICONDUCTOR ENG5 citations62
US7964949B2Jun 21, 2011
Tenon-and-mortise packaging structure
ADVANCED SEMICONDUCTOR ENG4 citations59
US8368216B2Feb 5, 2013
Semiconductor package
ADVANCED SEMICONDUCTOR ENG1 citations51
US8018075B2Sep 13, 2011
Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor package
ADVANCED SEMICONDUCTOR ENG0 citations51
CHANG HSIAO-CHUAN
3 patentsUS8274149B2Sep 25, 2012
Semiconductor device package having a buffer structure and method of fabricating the same
CHANG HSIAO-CHUAN14 citations82
US8421242B2Apr 16, 2013
Semiconductor package
CHANG HSIAO-CHUAN2 citations60
US8222726B2Jul 17, 2012
Semiconductor device package having a jumper chip and method of fabricating the same
CHANG HSIAO-CHUAN0 citations49