Inventor

SAVASTIOUK SERGEY

US28 patents

⚠️ This page may combine multiple inventors who share the name “SAVASTIOUK SERGEY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAVASTIOUK SERGEY

TRU SI TECHNOLOGIES INC

Packaging substrates for integrated circuits and soldering methods

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Packaging of integrated circuits and vertical integration

Package of integrated circuits and vertical integration

Attachment of integrated circuit structures and other substrates to substrates with vias

Attachment of integrated circuit structures and other substrates to substrates with vias

Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities

Packaging substrates for integrated circuits and soldering methods

Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners

Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby

Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques

Electroplating and electroless plating of conductive materials into openings, and structures obtained thereby

Thinning and dicing of semiconductor wafers using dry etch, and obtaining semiconductor chips with rounded bottom edges and corners

Brim and gas escape for non-contact wafer holder

Plasma processing comprising three rotational motions of an article being processed

INVENSAS CORP

Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques

Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates

Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers

Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor

Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers

KOSENKO VALENTIN

Substrates with through vias with conductive features for connection to integrated circuit elements, and methods for forming through vias in substrates

Optical interposer

Structures with through vias passing through a substrate comprising a planar insulating layer between semiconductor layers

Structures formed using monocrystalline silicon and/or other materials for optical and other applications

TRUSI TECHNOLOGIES LLC

Non-contact workpiece holder

Brim and gas escape for non-contact wafer holder

ALLVIA INC

Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques

SAVASTIOUK SERGEY

Dielectric trenches, nickel/tantalum oxide structures, and chemical mechanical polishing techniques