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Inventor
YU TAI-HENG
TW
2 patents
⚠️ This page may combine multiple inventors who share the name “YU TAI-HENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
1 patent
US9613796B2
Apr 4, 2017
Method of flattening a wafer
UNITED MICROELECTRONICS CORP
0 citations
43
YU TAI-HENG
1 patent
US9136105B2
Sep 15, 2015
Bevel etcher
YU TAI-HENG
0 citations
37