Inventor
TRAN ANDY QUANG
US15 patents
⚠️ This page may combine multiple inventors who share the name “TRAN ANDY QUANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TEXAS INSTRUMENTS INC
14 patentsUS9373569B1Jun 21, 2016
Flat no-lead packages with electroplated edges
TEXAS INSTRUMENTS INC4 citations82
US9171830B2Oct 27, 2015
Fabricating a proximity sensor having light-blocking structure in leadframe
TEXAS INSTRUMENTS INC8 citations81
US9768098B2Sep 19, 2017
Packaged semiconductor device having stacked attached chips overhanging the assembly pad
TEXAS INSTRUMENTS INC6 citations71
US9515059B2Dec 6, 2016
Proximity sensor having light-blocking structure in leadframe and method of making same
TEXAS INSTRUMENTS INC3 citations70
US11769247B2Sep 26, 2023
Exposed pad integrated circuit package
TEXAS INSTRUMENTS INC0 citations60
US11195269B2Dec 7, 2021
Exposed pad integrated circuit package
TEXAS INSTRUMENTS INC0 citations60
US9608158B2Mar 28, 2017
Proximity sensor having light-blocking structure in leadframe and method of making same
TEXAS INSTRUMENTS INC1 citations60
US9576886B1Feb 21, 2017
Flat no-lead packages with electroplated edges
TEXAS INSTRUMENTS INC1 citations60
US9219019B2Dec 22, 2015
Packaged semiconductor devices having solderable lead surfaces exposed by grooves in package compound
TEXAS INSTRUMENTS INC3 citations60
US8994154B2Mar 31, 2015
Proximity sensor having light blocking structure in leadframe
TEXAS INSTRUMENTS INC1 citations60
US10580723B2Mar 3, 2020
Flat no-lead packages with electroplated edges
TEXAS INSTRUMENTS INC0 citations50
US10366947B2Jul 30, 2019
Flat no-lead packages with electroplated edges
TEXAS INSTRUMENTS INC0 citations50
US10541194B2Jan 21, 2020
Semiconductor package with interconnected leads
TEXAS INSTRUMENTS INC0 citations49
US9721859B2Aug 1, 2017
Semi-hermetic semiconductor package
TEXAS INSTRUMENTS INC0 citations39