Inventor

PERFECTO ERIC

US3 patents

⚠️ This page may combine multiple inventors who share the name “PERFECTO ERIC”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

2 patents

US12300615B2May 13, 2025

Infrared debond damage mitigation by copper fill pattern

IBM0 citations61

US12469787B2Nov 11, 2025

Resist patterned redistribution wiring on copper polyimide via layer

IBM0 citations60

GLOBALFOUNDRIES INC

1 patent

US10438894B1Oct 8, 2019

Chip-to-chip and chip-to-substrate interconnections in multi-chip semiconductor devices

GLOBALFOUNDRIES INC13 citations79