Inventor
YANG CHIA-HAO
TW15 patents
⚠️ This page may combine multiple inventors who share the name “YANG CHIA-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MEDIATEK INC
8 patentsUS9369172B2Jun 14, 2016
Wireless communication device
MEDIATEK INC4 citations71
US10103128B2Oct 16, 2018
Semiconductor package incorporating redistribution layer interposer
MEDIATEK INC3 citations70
US9129962B1Sep 8, 2015
Bonding pad arrangment design for multi-die semiconductor package structure
MEDIATEK INC3 citations62
US9991227B2Jun 5, 2018
Bonding pad arrangement design for multi-die semiconductor package structure
MEDIATEK INC0 citations51
US9564395B2Feb 7, 2017
Bonding pad arrangment design for multi-die semiconductor package structure
MEDIATEK INC0 citations51
US9801136B2Oct 24, 2017
Wireless communication device
MEDIATEK INC0 citations50
US9713093B2Jul 18, 2017
Wireless communication device
MEDIATEK INC0 citations50
US9258030B2Feb 9, 2016
Wireless communication device
MEDIATEK INC0 citations40
SILICON INTEGRATED SYS CORP
3 patentsUS7603095B2Oct 13, 2009
Apparatus and method of switching intervals
SILICON INTEGRATED SYS CORP5 citations61
US7202716B1Apr 10, 2007
Apparatus and method of controlling and tuning a fine calibration for clock source synchronization in dual loop of hybrid phase and time domain
SILICON INTEGRATED SYS CORP3 citations60
US7411429B2Aug 12, 2008
System and method for clock switching
SILICON INTEGRATED SYS CORP0 citations50