Inventor

COLLINS ANDREW PAUL

US3 patents

Patents

3 patents

US12347780B2Jul 1, 2025

Integrated circuit package with flipped high bandwidth memory device

INTEL CORP1 citations60

US11387187B2Jul 12, 2022

Embedded very high density (VHD) layer

INTEL CORP0 citations60

US12436912B2Oct 7, 2025

Disaggregated die with input/output (I/O) tiles

INTEL CORP0 citations39