Inventor
HUANG HSIN-FU
TW50 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HSIN-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
30 patentsUS10043811B1Aug 7, 2018
Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same
UNITED MICROELECTRONICS CORP14 citations92
US9679813B2Jun 13, 2017
Semiconductor structure and process for forming plug including layer with pulled back sidewall part
UNITED MICROELECTRONICS CORP9 citations84
US9018086B2Apr 28, 2015
Semiconductor device having a metal gate and fabricating method thereof
UNITED MICROELECTRONICS CORP7 citations84
US8735269B1May 27, 2014
Method for forming semiconductor structure having TiN layer
UNITED MICROELECTRONICS CORP7 citations84
US11968906B2Apr 23, 2024
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP5 citations83
US10199269B2Feb 5, 2019
Conductive structure and method for manufacturing conductive structure
UNITED MICROELECTRONICS CORP6 citations83
US9755047B2Sep 5, 2017
Semiconductor process and semiconductor device
UNITED MICROELECTRONICS CORP2 citations73
US9640482B1May 2, 2017
Semiconductor device with a contact plug and method of fabricating the same
UNITED MICROELECTRONICS CORP6 citations72
US11239243B2Feb 1, 2022
Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same
UNITED MICROELECTRONICS CORP0 citations62
US12237395B2Feb 25, 2025
High electron mobility transistor and method for forming the same
UNITED MICROELECTRONICS CORP0 citations61
US12211888B2Jan 28, 2025
Method for forming a thin film resistor with improved thermal stability
UNITED MICROELECTRONICS CORP0 citations61
US11877433B2Jan 16, 2024
Storage node contact structure of a memory device
UNITED MICROELECTRONICS CORP0 citations61
US12389807B2Aug 12, 2025
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations60
US12279536B2Apr 15, 2025
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations60
US11424408B2Aug 23, 2022
ReRAM structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations60
US11165019B2Nov 2, 2021
ReRAM structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations60
US10685964B2Jun 16, 2020
Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same
UNITED MICROELECTRONICS CORP0 citations52
US10199228B2Feb 5, 2019
Manufacturing method of metal gate structure
UNITED MICROELECTRONICS CORP0 citations52
US10068797B2Sep 4, 2018
Semiconductor process for forming plug
UNITED MICROELECTRONICS CORP0 citations52
US9985110B2May 29, 2018
Semiconductor process
UNITED MICROELECTRONICS CORP0 citations52
US9653300B2May 16, 2017
Structure of metal gate structure and manufacturing method of the same
UNITED MICROELECTRONICS CORP0 citations52
US9570348B2Feb 14, 2017
Method of forming contact strucutre
UNITED MICROELECTRONICS CORP1 citations52
US9312121B1Apr 12, 2016
Method for cleaning contact hole and forming contact plug therein
UNITED MICROELECTRONICS CORP1 citations52
US9190292B2Nov 17, 2015
Manufacturing process of gate stack structure with etch stop layer
UNITED MICROELECTRONICS CORP0 citations52
US9087782B2Jul 21, 2015
Manufacturing process of gate stack structure with etch stop layer
UNITED MICROELECTRONICS CORP0 citations52
US10756090B2Aug 25, 2020
Storage node contact structure of a memory device and manufacturing methods thereof
UNITED MICROELECTRONICS CORP0 citations51
US10497617B2Dec 3, 2019
Conductive structure and method for manufacturing conductive structure
UNITED MICROELECTRONICS CORP0 citations51
US9130032B2Sep 8, 2015
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations51
US9076784B2Jul 7, 2015
Transistor and semiconductor structure
UNITED MICROELECTRONICS CORP0 citations51
US9558996B2Jan 31, 2017
Method for filling trench with metal layer and semiconductor structure formed by using the same
UNITED MICROELECTRONICS CORP0 citations49
HUANG HSIN-FU
4 patentsUSD428301SJul 18, 2000
Chopper
HUANG HSIN-FU6 citations72
US8662692B2Mar 4, 2014
Touch panel using assembling frame for assembly
HUANG HSIN-FU5 citations71
US8420544B2Apr 16, 2013
Method for fabricating interconnection structure with dry-cleaning process
HUANG HSIN-FU3 citations61
US8841733B2Sep 23, 2014
Semiconductor device and method of fabricating the same
HUANG HSIN-FU0 citations50