P

Inventor

HUANG HSIN-FU

TW50 patents
⚠️ This page may combine multiple inventors who share the name “HUANG HSIN-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

UNITED MICROELECTRONICS CORP

30 patents
US10043811B1Aug 7, 2018

Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same

UNITED MICROELECTRONICS CORP14 citations92
US9679813B2Jun 13, 2017

Semiconductor structure and process for forming plug including layer with pulled back sidewall part

UNITED MICROELECTRONICS CORP9 citations84
US9018086B2Apr 28, 2015

Semiconductor device having a metal gate and fabricating method thereof

UNITED MICROELECTRONICS CORP7 citations84
US8735269B1May 27, 2014

Method for forming semiconductor structure having TiN layer

UNITED MICROELECTRONICS CORP7 citations84
US11968906B2Apr 23, 2024

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP5 citations83
US10199269B2Feb 5, 2019

Conductive structure and method for manufacturing conductive structure

UNITED MICROELECTRONICS CORP6 citations83
US9755047B2Sep 5, 2017

Semiconductor process and semiconductor device

UNITED MICROELECTRONICS CORP2 citations73
US9640482B1May 2, 2017

Semiconductor device with a contact plug and method of fabricating the same

UNITED MICROELECTRONICS CORP6 citations72
US11239243B2Feb 1, 2022

Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same

UNITED MICROELECTRONICS CORP0 citations62
US12237395B2Feb 25, 2025

High electron mobility transistor and method for forming the same

UNITED MICROELECTRONICS CORP0 citations61
US12211888B2Jan 28, 2025

Method for forming a thin film resistor with improved thermal stability

UNITED MICROELECTRONICS CORP0 citations61
US11877433B2Jan 16, 2024

Storage node contact structure of a memory device

UNITED MICROELECTRONICS CORP0 citations61
US12389807B2Aug 12, 2025

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP0 citations60
US12279536B2Apr 15, 2025

Semiconductor device and method for fabricating the same

UNITED MICROELECTRONICS CORP0 citations60
US11424408B2Aug 23, 2022

ReRAM structure and method of fabricating the same

UNITED MICROELECTRONICS CORP0 citations60
US11165019B2Nov 2, 2021

ReRAM structure and method of fabricating the same

UNITED MICROELECTRONICS CORP0 citations60
US10685964B2Jun 16, 2020

Semiconductor structure for preventing row hammering issue in DRAM cell and method for manufacturing the same

UNITED MICROELECTRONICS CORP0 citations52
US10199228B2Feb 5, 2019

Manufacturing method of metal gate structure

UNITED MICROELECTRONICS CORP0 citations52
US10068797B2Sep 4, 2018

Semiconductor process for forming plug

UNITED MICROELECTRONICS CORP0 citations52
US9985110B2May 29, 2018

Semiconductor process

UNITED MICROELECTRONICS CORP0 citations52
US9653300B2May 16, 2017

Structure of metal gate structure and manufacturing method of the same

UNITED MICROELECTRONICS CORP0 citations52
US9570348B2Feb 14, 2017

Method of forming contact strucutre

UNITED MICROELECTRONICS CORP1 citations52
US9312121B1Apr 12, 2016

Method for cleaning contact hole and forming contact plug therein

UNITED MICROELECTRONICS CORP1 citations52
US9190292B2Nov 17, 2015

Manufacturing process of gate stack structure with etch stop layer

UNITED MICROELECTRONICS CORP0 citations52
US9087782B2Jul 21, 2015

Manufacturing process of gate stack structure with etch stop layer

UNITED MICROELECTRONICS CORP0 citations52
US10756090B2Aug 25, 2020

Storage node contact structure of a memory device and manufacturing methods thereof

UNITED MICROELECTRONICS CORP0 citations51
US10497617B2Dec 3, 2019

Conductive structure and method for manufacturing conductive structure

UNITED MICROELECTRONICS CORP0 citations51
US9130032B2Sep 8, 2015

Semiconductor device

UNITED MICROELECTRONICS CORP0 citations51
US9076784B2Jul 7, 2015

Transistor and semiconductor structure

UNITED MICROELECTRONICS CORP0 citations51
US9558996B2Jan 31, 2017

Method for filling trench with metal layer and semiconductor structure formed by using the same

UNITED MICROELECTRONICS CORP0 citations49

HUANG HSIN-FU

4 patents

TA FENG ELECTRICAL APPLIANCES CO LTD

2 patents

(unassigned)

2 patents

LIN KUN-HSIEN

2 patents

HSU CHI-MAO

2 patents

TSAI MIN-CHUAN

1 patent

YANG CHAN-LON

1 patent

LIAO PO-JUI

1 patent

TA FENG ELECTRICAL APPLIANCE CO

1 patent

LAI CHIEN-MING

1 patent

HSIEH YA-HSUEH

1 patent

HANNSTAR DISPLAY CORP

1 patent

LIN MARK

1 patent