Inventor
LIN CHIN-FU
TW84 patents
⚠️ This page may combine multiple inventors who share the name “LIN CHIN-FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
24 patentsUS10121827B1Nov 6, 2018
Semiconductor structure and the method of making the same
UNITED MICROELECTRONICS CORP7 citations84
US9263257B2Feb 16, 2016
Semiconductor device having fin-shaped structure and method for fabricating the same
UNITED MICROELECTRONICS CORP8 citations84
US9018086B2Apr 28, 2015
Semiconductor device having a metal gate and fabricating method thereof
UNITED MICROELECTRONICS CORP7 citations84
US8735269B1May 27, 2014
Method for forming semiconductor structure having TiN layer
UNITED MICROELECTRONICS CORP7 citations84
US8951884B1Feb 10, 2015
Method for forming a FinFET structure
UNITED MICROELECTRONICS CORP7 citations83
US9397189B2Jul 19, 2016
Semiconductor structure having a metal gate with side wall spacers
UNITED MICROELECTRONICS CORP3 citations73
US9263282B2Feb 16, 2016
Method of fabricating semiconductor patterns
UNITED MICROELECTRONICS CORP5 citations73
US9159831B2Oct 13, 2015
Multigate field effect transistor and process thereof
UNITED MICROELECTRONICS CORP4 citations73
US11545521B2Jan 3, 2023
Magnetic tunnel junction (MTJ) device and forming method thereof
UNITED MICROELECTRONICS CORP2 citations72
US10756128B2Aug 25, 2020
Integrated circuit device and method of fabricating integrated circuit
UNITED MICROELECTRONICS CORP5 citations71
US8815703B2Aug 26, 2014
Fabricating method of shallow trench isolation structure
UNITED MICROELECTRONICS CORP4 citations68
US9184292B2Nov 10, 2015
Semiconductor structure with different fins of FinFETs
UNITED MICROELECTRONICS CORP2 citations63
US8361854B2Jan 29, 2013
Fin field-effect transistor structure and manufacturing process thereof
UNITED MICROELECTRONICS CORP3 citations63
US11950431B2Apr 2, 2024
Magnetic tunnel junction (MTJ) device and forming method thereof
UNITED MICROELECTRONICS CORP0 citations62
US11450747B2Sep 20, 2022
Semiconductor structure with an epitaxial layer
UNITED MICROELECTRONICS CORP0 citations62
US11011376B2May 18, 2021
Method of manufacturing semiconductor structure with an epitaxial layer
UNITED MICROELECTRONICS CORP0 citations62
US10943948B2Mar 9, 2021
Magnetic tunnel junction (MTJ) device and forming method thereof
UNITED MICROELECTRONICS CORP0 citations62
US11476367B2Oct 18, 2022
Semiconductor device
UNITED MICROELECTRONICS CORP0 citations61
US11133418B2Sep 28, 2021
Semiconductor device and method for fabricating the same
UNITED MICROELECTRONICS CORP0 citations61
US11424408B2Aug 23, 2022
ReRAM structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations60
US11165019B2Nov 2, 2021
ReRAM structure and method of fabricating the same
UNITED MICROELECTRONICS CORP0 citations60
US7189649B2Mar 13, 2007
Method of forming a material film
UNITED MICROELECTRONICS CORP3 citations58
US7538024B2May 26, 2009
Method of fabricating a dual-damascene copper structure
UNITED MICROELECTRONICS CORP2 citations54
US10504594B1Dec 10, 2019
Non-volatile memory and forming method thereof
UNITED MICROELECTRONICS CORP0 citations52
TU HSIU-WEN
5 patentsUS8390087B2Mar 5, 2013
Image sensor package structure with large air cavity
TU HSIU-WEN7 citations80
US8928104B2Jan 6, 2015
Image sensor packaging structure with black encapsulant
TU HSIU-WEN4 citations71
US8847146B2Sep 30, 2014
Image sensor package structure with casing including a vent without sealing and in communication with package material
TU HSIU-WEN4 citations71
US8441086B2May 14, 2013
Image sensor packaging structure with predetermined focal length
TU HSIU-WEN6 citations71
US8093674B2Jan 10, 2012
Manufacturing method for molding image sensor package structure and image sensor package structure thereof
TU HSIU-WEN5 citations61
CHIEN CHIN-CHENG
4 patentsUS8551829B2Oct 8, 2013
Method for manufacturing multi-gate transistor device
CHIEN CHIN-CHENG11 citations84
US8497198B2Jul 30, 2013
Semiconductor process
CHIEN CHIN-CHENG8 citations84
US9559189B2Jan 31, 2017
Non-planar FET
CHIEN CHIN-CHENG3 citations73
US9318567B2Apr 19, 2016
Fabrication method for semiconductor devices
CHIEN CHIN-CHENG2 citations62
LIN CHIN-FU
3 patentsUS8609529B2Dec 17, 2013
Fabrication method and structure of through silicon via
LIN CHIN-FU7 citations83
US8860150B2Oct 14, 2014
Metal gate structure
LIN CHIN-FU6 citations72
US8822284B2Sep 2, 2014
Method for fabricating FinFETs and semiconductor structure fabricated using the method
LIN CHIN-FU4 citations72
TSAI TENG-CHUN
2 patentsHSU CHI-MAO
2 patentsCHEN YI-WEI
1 patentFU SSU-I
1 patentTSAI SHIH-HUNG
1 patentTSAI MIN-CHUAN
1 patentTAIWAN SEMICONDUCTOR MFG
1 patentLIU CHIH-CHIEN
1 patentYANG CHAN-LON
1 patentHSIN CHUNG-HSIEN
1 patentLIN CHUN-HSIEN
1 patentHUANG HSIN-FU
1 patentShowing the top 50 of 84 patents by PatentIndex Score.