Inventor

MCTEER ALLEN

US81 patents

⚠️ This page may combine multiple inventors who share the name “MCTEER ALLEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MCTEER ALLEN

MICRON TECHNOLOGY INC

Integrated circuit device and fabrication using metal-doped chalcogenide materials

Selective cap layers over recessed polysilicon plugs

Copper diffusion barrier, aluminum wetting layer and improved methods for filling openings in silicon substrates with cooper

Integrated circuit device and fabrication using metal-doped chalcogenide materials

Integrated circuit device and fabrication using metal-doped chalcogenide materials

Copper diffusion barrier, aluminum wetting layer and improved methods for filling openings in silicon substrates with copper

Reducing reflectivity on a semiconductor wafer by annealing titanium and aluminum

Method for increased metal interconnect reliability in situ formation of titanium aluminide

Layered resistance variable memory device and method of fabrication

Methods for determining a dose of an impurity implanted in a semiconductor substrate

Layered resistance variable memory device and method of fabrication

Interconnect structure for use in an integrated circuit

Method of forming a multi-layered copper bond pad for an integrated circuit

Multi-layered copper bond pad for an integrated circuit

Copper interconnect for an integrated circuit and methods for its fabrication

Formation of electrical contacts to conductive elements in the fabrication of semiconductor integrated circuits

Method for forming dual damascene structures

Methods of selectively oxidizing semiconductor structures, and structures resulting therefrom

Method of photoresist strip for plasma doping process of semiconductor manufacturing

Co-sputter deposition of metal-doped chalcogenides

Suppression of hillock formation in thin aluminum films

Methods of reducing corrosion of materials, methods of protecting aluminum within aluminum-comprising layers from electrochemical degradation during semiconductor processing methods of forming aluminum-comprising lines

Memory cells having regions containing one or both of carbon and boron

Methods of forming doped regions in semiconductor substrates

Systems and methods for plasma processing of microfeature workpieces

Silver selenide film stoichiometry and morphology control in sputter deposition

Method of forming an interconnect structure for a semiconductor device

Methods of depositing silver onto a metal selenide-comprising surface and methods of depositing silver onto a selenium-comprising surface

Memory cell with selective deposition of refractory metals

Silver selenide film stoichiometry and morphology control in sputter deposition

Elimination of dendrite formation during metal/chalcogenide glass deposition

Elimination of dendrite formation during metal/chalcogenide glass deposition

Semiconductor constructions comprising aluminum-containing layers

Formation of electrical contacts to conductive elements in the fabrication of semiconductor integrated circuits

Semiconductor processing methods of polishing aluminum-comprising layers

Methods of reducing corrosion of materials, methods of protecting aluminum within aluminum-comprising layers from electrochemical degradation during semiconductor processing, and semicoductor processing methods of forming aluminum-comprising lines

Metallization on titanium aluminide

Suppression of hillock formation in thin aluminum films

Reducing reflectivity on a semiconductor wafer by annealing aluminum and titanium

Voidless metallization on titanium aluminide in an interconnect

Integrated structures and methods of forming integrated structures

Integrated structures and methods of forming integrated structures

Integrated structures and methods of forming integrated structures

Co-sputter deposition of metal-doped chalcogenides

Co-sputter deposition of metal-doped chalcogenides

Systems and methods for plasma processing of microfeature workpieces

INTEL CORP

Barrier film techniques and configurations for phase-change memory elements

Seed layer for reduced resistance tungsten film

CAMPBELL KRISTY A

Layered resistance variable memory device and method of fabrication

QIN SHU

Systems and methods for plasma doping microfeature workpieces