Inventor

CHOU CHIA-HSING

TW6 patents

⚠️ This page may combine multiple inventors who share the name “CHOU CHIA-HSING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ASUSTEK COMP INC

2 patents

US7791881B2Sep 7, 2010

Heat-dissipating mechanism for use with memory module

ASUSTEK COMP INC21 citations89

US7957141B2Jun 7, 2011

Heat-dissipating mechanism for use with memory module

ASUSTEK COMP INC4 citations59

CHOU CHIA-HSING

2 patents

US8059403B2Nov 15, 2011

Heat dissipation device

CHOU CHIA-HSING17 citations76

US8220144B2Jul 17, 2012

Method for improving an Electromagnetic bandgap structure

CHOU CHIA-HSING0 citations47

TAIWAN SEMICONDUCTOR MFG CO LTD

1 patent

US11189654B2Nov 30, 2021

Manufacturing methods of semiconductor image sensor devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

ADVANCED SEMICONDUCTOR ENG

1 patent

US7838777B2Nov 23, 2010

Signal transmission structure, package structure and bonding method thereof

ADVANCED SEMICONDUCTOR ENG0 citations39