Inventor

MENGEL MANFRED

DE57 patents

⚠️ This page may combine multiple inventors who share the name “MENGEL MANFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MENGEL MANFRED

INFINEON TECHNOLOGIES AG

Semiconductor device with parylene coating

Curing layers of a semiconductor product using electromagnetic fields

Flexible rewiring plate for semiconductor components, and process for producing it

Electrically insulating thermal interface on the discontinuity of an encapsulation structure

Electrically insulating thermal interface on the discontinuity of an encapsulation structure

Chip arrangement, a method for manufacturing a chip arrangement, integrated circuits and a method for manufacturing an integrated circuit

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

Thermoelectric devices and methods for forming thermoelectric devices

Wafer box, method for arranging wafers in a wafer box, wafer protection plate and method for protecting a wafer

Micromechanical semiconductor sensing device

Semiconductor device

Integrated circuit device having a gas-phase deposited insulation layer

Encapsulation of a chip module

Method for producing a device and device

Integrated circuit arrangement

Chip arrangements

Wafer box, wafer stacking aid, wafer carrier, wafer transport system, method for loading a wafer box with wafers and method for removing wafers from a wafer box

Method for manufacturing a chip arrangement including a ceramic layer

Micromechanical semiconductor sensing device

Electronic component

Semiconductor device

Semiconductor module with a dielectric layer including a fluorocarbon compound on a chip

Semiconductor device

Semiconductor device

Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof

Method of fabricating a semiconductor device

MENGEL MANFRED

Chip-package and a method for forming a chip-package

Method and system for improving reliability of a semiconductor device

Device and method for manufacturing a device

Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module

Method of manufacturing a semiconductor device

Method and system for minimizing carrier stress of a semiconductor device

Low viscosity polymeric printing solutions and electronic components bearing polyimide based upon the low viscosity polymeric printing solutions

Semiconductor device

Coating composition and a method of coating

MAHLER JOACHIM

Semiconductor device including a polymer disposed on a carrier

Method for electrophoretically depositing a film on an electronic assembly

Electronic component

Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module

Method of manufacturing semiconductor devices

BAYER AG

Process for the reduction of nitrogen oxides

Zeolite A with improved properties

Stabilizing pigmented lacquers with zeolites

HOSSEINI KHALIL

Device including two power semiconductor chips and manufacturing thereof

Semiconductor device with a layer including niobium, and/or tantalum overlying a contact pad or a metal layer

TORWESTEN HOLGER

Method for manufacturing a chip package

Chip package and method of forming the same

OTREMBA RALF

Electronic device including a carrier and a semiconductor chip attached to the carrier and manufacturing thereof

HANKHOFER JOHANNES

Protection for circuit boards

KALZ FRANZ-PETER

Micromechanical semiconductor sensing device