Inventor

KALZ FRANZ-PETER

DE20 patents

⚠️ This page may combine multiple inventors who share the name “KALZ FRANZ-PETER”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KALZ FRANZ-PETER

INFINEON TECHNOLOGIES AG

Semiconductor device including antistatic die attach material

Semiconductor sensor device and method for fabricating the same

Package with component connected with carrier via spacer particles

Method of manufacturing a chip package, chip package, method of manufacturing a chip assembly and chip assembly

Micromechanical semiconductor sensing device

Package with component connected with carrier via spacer particles

Semiconductor device including antistatic die attach material

Method for manufacturing a chip arrangement including a ceramic layer

Micromechanical semiconductor sensing device

Electronic component

Deposition of protective material at wafer level in front end for early stage particle and moisture protection

Deposition of protective material at wafer level in front end for early stage particle and moisture protection

Chip package and chip assembly

MAHLER JOACHIM

Method for electrophoretically depositing a film on an electronic assembly

Electronic component

Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module

KALZ FRANZ-PETER

Micromechanical semiconductor sensing device

Chip, method for producing a chip and device for laser ablation

ELIAN KLAUS

Sensor device and method

HOSSEINI KHALIL

Device including two power semiconductor chips and manufacturing thereof