Inventor
OHKAWA HIROSHIGE
JP5 patents
⚠️ This page may combine multiple inventors who share the name “OHKAWA HIROSHIGE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TDK CORP
4 patentsUS6908960B2Jun 21, 2005
Composite dielectric material, composite dielectric substrate, prepreg, coated metal foil, molded sheet, composite magnetic substrate, substrate, double side metal foil-clad substrate, flame retardant substrate, polyvinylbenzyl ether resin composition, thermosettin
TDK CORP58 citations94
US6407020B1Jun 18, 2002
Ceramics composition
TDK CORP3 citations60
US9635756B2Apr 25, 2017
Circuit board incorporating semiconductor IC and manufacturing method thereof
TDK CORP0 citations50
US12243841B2Mar 4, 2025
Electronic component embedded substrate and circuit module using the same
TDK CORP0 citations45