Inventor
JAIRATH RAHUL
US19 patents
⚠️ This page may combine multiple inventors who share the name “JAIRATH RAHUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
10 patentsUS6111634AAug 29, 2000
Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
LAM RES CORP155 citations98
US5762536AJun 9, 1998
Sensors for a linear polisher
LAM RES CORP150 citations98
US6146248ANov 14, 2000
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
LAM RES CORP114 citations97
US6108091AAug 22, 2000
Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
LAM RES CORP86 citations96
US6261155B1Jul 17, 2001
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
LAM RES CORP42 citations95
US6336845B1Jan 8, 2002
Method and apparatus for polishing semiconductor wafers
LAM RES CORP45 citations94
US6328642B1Dec 11, 2001
Integrated pad and belt for chemical mechanical polishing
LAM RES CORP66 citations94
US6621584B2Sep 16, 2003
Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
LAM RES CORP36 citations92
US6517418B2Feb 11, 2003
Method of transporting a semiconductor wafer in a wafer polishing system
LAM RES CORP18 citations92
US6656025B2Dec 2, 2003
Integrated pad and belt for chemical mechanical polishing
LAM RES CORP5 citations72
NAT SEMICONDUCTOR CORP
3 patentsUS5478435ADec 26, 1995
Point of use slurry dispensing system
NAT SEMICONDUCTOR CORP161 citations96
US5688360ANov 18, 1997
Method and apparatus for polishing a semiconductor substrate wafer
NAT SEMICONDUCTOR CORP29 citations92
US5665656ASep 9, 1997
Method and apparatus for polishing a semiconductor substrate wafer
NAT SEMICONDUCTOR CORP40 citations92