Inventor
KRUSELL WILBUR C
US30 patents
⚠️ This page may combine multiple inventors who share the name “KRUSELL WILBUR C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
LAM RES CORP
19 patentsUS6111634AAug 29, 2000
Method and apparatus for in-situ monitoring of thickness using a multi-wavelength spectrometer during chemical-mechanical polishing
LAM RES CORP155 citations98
US6146248ANov 14, 2000
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
LAM RES CORP114 citations97
US6274059B1Aug 14, 2001
Method to remove metals in a scrubber
LAM RES CORP55 citations96
US6165956ADec 26, 2000
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
LAM RES CORP46 citations96
US6162301ADec 19, 2000
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
LAM RES CORP56 citations96
US6108091AAug 22, 2000
Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
LAM RES CORP86 citations96
US6334229B1Jan 1, 2002
Apparatus for cleaning edges of contaminated substrates
LAM RES CORP63 citations95
US6261155B1Jul 17, 2001
Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
LAM RES CORP42 citations95
US6336845B1Jan 8, 2002
Method and apparatus for polishing semiconductor wafers
LAM RES CORP45 citations94
US6328642B1Dec 11, 2001
Integrated pad and belt for chemical mechanical polishing
LAM RES CORP66 citations94
US6621584B2Sep 16, 2003
Method and apparatus for in-situ monitoring of thickness during chemical-mechanical polishing
LAM RES CORP36 citations92
US6517418B2Feb 11, 2003
Method of transporting a semiconductor wafer in a wafer polishing system
LAM RES CORP18 citations92
US6325706B1Dec 4, 2001
Use of zeta potential during chemical mechanical polishing for end point detection
LAM RES CORP54 citations92
US6186865B1Feb 13, 2001
Apparatus and method for performing end point detection on a linear planarization tool
LAM RES CORP38 citations92
US6224461B1May 1, 2001
Method and apparatus for stabilizing the process temperature during chemical mechanical polishing
LAM RES CORP44 citations91
US6479443B1Nov 12, 2002
Cleaning solution and method for cleaning semiconductor substrates after polishing of copper film
LAM RES CORP15 citations84
US6927198B2Aug 9, 2005
Methods and apparatus for cleaning semiconductor substrates after polishing of copper film
LAM RES CORP9 citations73
US6145148ANov 14, 2000
Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF)
LAM RES CORP8 citations73
US6656025B2Dec 2, 2003
Integrated pad and belt for chemical mechanical polishing
LAM RES CORP5 citations72
ONTRAK SYSTEMS INC
9 patentsUS5868863AFeb 9, 1999
Method and apparatus for cleaning of semiconductor substrates using hydrofluoric acid (HF)
ONTRAK SYSTEMS INC34 citations95
US5861066AJan 19, 1999
Method and apparatus for cleaning edges of contaminated substrates
ONTRAK SYSTEMS INC88 citations95
US5762084AJun 9, 1998
Megasonic bath
ONTRAK SYSTEMS INC46 citations92
US5745946AMay 5, 1998
Substrate processing system
ONTRAK SYSTEMS INC68 citations92
US5853522ADec 29, 1998
Drip chemical delivery apparatus
ONTRAK SYSTEMS INC22 citations91
US5723019AMar 3, 1998
Drip chemical delivery method and apparatus
ONTRAK SYSTEMS INC32 citations91
US5693148ADec 2, 1997
Process for brush cleaning
ONTRAK SYSTEMS INC38 citations91
US5840129ANov 24, 1998
Hesitation free roller
ONTRAK SYSTEMS INC22 citations89
US6003185ADec 21, 1999
Hesitation free roller
ONTRAK SYSTEMS INC16 citations78