Inventor

CHOU TAI-YU

US4 patents

⚠️ This page may combine multiple inventors who share the name “CHOU TAI-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LSI LOGIC CORP

2 patents

US5691568ANov 25, 1997

Wire bondable package design with maxium electrical performance and minimum number of layers

LSI LOGIC CORP106 citations96

US5672911ASep 30, 1997

Apparatus to decouple core circuits power supply from input-output circuits power supply in a semiconductor device package

LSI LOGIC CORP82 citations94

EXPRESS PACKAGING SYSTEMS INC

1 patent

US5825084AOct 20, 1998

Single-core two-side substrate with u-strip and co-planar signal traces, and power and ground planes through split-wrap-around (SWA) or split-via-connections (SVC) for packaging IC devices

EXPRESS PACKAGING SYSTEMS INC117 citations93

SUN MICROSYSTEMS INC

1 patent

US6519747B2Feb 11, 2003

Method and apparatus for defining signal timing for an integrated circuit device

SUN MICROSYSTEMS INC0 citations40