Inventor
ROBERTS CARL M
US4 patents
Patents
4 patentsUS7563632B2Jul 21, 2009
Methods for packaging and sealing an integrated circuit die
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US7357017B2Apr 15, 2008
Wafer level capped sensor
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US7275424B2Oct 2, 2007
Wafer level capped sensor
ANALOG DEVICES INC51 citations91
US4866505ASep 12, 1989
Aluminum-backed wafer and chip
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