P

Inventor

LIN KUO-YIN

TW33 patents
⚠️ This page may combine multiple inventors who share the name “LIN KUO-YIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

21 patents
US9768303B2Sep 19, 2017

Method and structure for FinFET device

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US9236446B2Jan 12, 2016

Barc-assisted process for planar recessing or removing of variable-height layers

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations84
US9592585B2Mar 14, 2017

System and method for CMP station cleanliness

TAIWAN SEMICONDUCTOR MFG CO LTD8 citations83
US11529712B2Dec 20, 2022

CMP polishing head design for improving removal rate uniformity

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations72
US10160091B2Dec 25, 2018

CMP polishing head design for improving removal rate uniformity

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11312882B2Apr 26, 2022

CMP slurry solution for hardened fluid material

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11031391B2Jun 8, 2021

Method for manufacturing a FinFET device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011385B2May 18, 2021

CMP-friendly coatings for planar recessing or removing of variable-height layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10461080B2Oct 29, 2019

Method for manufacturing a FinFET device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9852899B2Dec 26, 2017

Wafer back-side polishing system and method for integrated circuit device manufacturing processes

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9748109B2Aug 29, 2017

CMP-friendly coatings for planar recessing or removing of variable-height layers

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9559021B2Jan 31, 2017

Wafer back-side polishing system and method for integrated circuit device manufacturing processes

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US9287127B2Mar 15, 2016

Wafer back-side polishing system and method for integrated circuit device manufacturing processes

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations62
US11865666B2Jan 9, 2024

CMP polishing head design for improving removal rate uniformity

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US10868180B2Dec 15, 2020

Method and structure for FinFET devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10714615B2Jul 14, 2020

Method and structure for FinFET devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10164102B2Dec 25, 2018

Method and structure for FinFET devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9954105B2Apr 24, 2018

Method and structure for FinFET devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9478431B2Oct 25, 2016

BARC-assisted process for planar recessing or removing of variable-height layers

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10774241B2Sep 15, 2020

CMP slurry solution for hardened fluid material

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9508716B2Nov 29, 2016

Methods of manufacturing a semiconductor device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41

TAIWAN SEMICONDUCTOR MFG

9 patents

PENG CHIH I

1 patent

LIN KUO-YIN

1 patent

LIN KUO YIN

1 patent