Inventor
HUANG YU YI
TW7 patents
⚠️ This page may combine multiple inventors who share the name “HUANG YU YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
4 patentsUS9842790B2Dec 12, 2017
Conductive line system and process
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12543604B2Feb 3, 2026
Adding sealing material to wafer edge for wafer bonding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10643916B2May 5, 2020
Conductive line system and process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US10269675B2Apr 23, 2019
Conductive line system and process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
TAIWAN SEMICONDUCTOR MFG
3 patentsUS9117881B2Aug 25, 2015
Conductive line system and process
TAIWAN SEMICONDUCTOR MFG2 citations61
US9368402B2Jun 14, 2016
Conductive line system and process
TAIWAN SEMICONDUCTOR MFG0 citations51
US8373282B2Feb 12, 2013
Wafer level chip scale package with reduced stress on solder balls
TAIWAN SEMICONDUCTOR MFG1 citations51