Inventor
TANWONGWAN WIWAT
TH5 patents
Patents
5 patentsUS11637024B2Apr 25, 2023
Method for glob top encapsulation using molding tape with elevated sidewall
NXP BV0 citations55
US10847385B2Nov 24, 2020
Glob top encapsulation using molding tape
NXP BV1 citations55
US11114239B2Sep 7, 2021
Electronic device, device package, and method of fabrication
NXP BV0 citations47
US9824980B2Nov 21, 2017
Lead finger locking structure
NXP BV0 citations36
US10763203B1Sep 1, 2020
Conductive trace design for smart card
NXP BV0 citations34