Inventor
SOBIESKI DANIEL N
US16 patents
⚠️ This page may combine multiple inventors who share the name “SOBIESKI DANIEL N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
13 patentsUS9941054B2Apr 10, 2018
Integration of embedded thin film capacitors in package substrates
INTEL CORP9 citations84
US9899311B2Feb 20, 2018
Hybrid pitch package with ultra high density interconnect capability
INTEL CORP2 citations73
US9633938B2Apr 25, 2017
Hybrid pitch package with ultra high density interconnect capability
INTEL CORP2 citations73
US10375832B2Aug 6, 2019
Method of forming an interference shield on a substrate
INTEL CORP2 citations72
US11322457B2May 3, 2022
Control of warpage using ABF GC cavity for embedded die package
INTEL CORP2 citations70
US9232686B2Jan 5, 2016
Thin film based electromagnetic interference shielding with BBUL/coreless packages
INTEL CORP2 citations62
US12009318B2Jun 11, 2024
Control of warpage using ABF GC cavity for embedded die package
INTEL CORP0 citations59
US9941219B2Apr 10, 2018
Control of warpage using ABF GC cavity for embedded die package
INTEL CORP1 citations55
US10494700B2Dec 3, 2019
Method of fabricating a microelectronic substrate
INTEL CORP0 citations51
US9758845B2Sep 12, 2017
Microelectronic substrates having copper alloy conductive route structures
INTEL CORP0 citations51
US10070537B2Sep 4, 2018
Formation of dielectric with smooth surface
INTEL CORP0 citations50
US10658307B2May 19, 2020
Control of warpage using ABF GC cavity for embedded die package
INTEL CORP0 citations45
US10103037B2Oct 16, 2018
Flexible microelectronic systems and methods of fabricating the same
INTEL CORP0 citations37