Inventor
DELANEY DREW W
US11 patents
⚠️ This page may combine multiple inventors who share the name “DELANEY DREW W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
6 patentsUS7141452B2Nov 28, 2006
Methods of reducing bleed-out of underfill and adhesive materials
INTEL CORP11 citations81
US10375832B2Aug 6, 2019
Method of forming an interference shield on a substrate
INTEL CORP2 citations72
US9627227B2Apr 18, 2017
Bumpless build-up layer package warpage reduction
INTEL CORP4 citations72
US9232686B2Jan 5, 2016
Thin film based electromagnetic interference shielding with BBUL/coreless packages
INTEL CORP2 citations62
US8987065B2Mar 24, 2015
Forming functionalized carrier structures with coreless packages
INTEL CORP1 citations57
US9257380B2Feb 9, 2016
Forming functionalized carrier structures with coreless packages
INTEL CORP0 citations51
NALLA RAVI K
3 patentsUS8618652B2Dec 31, 2013
Forming functionalized carrier structures with coreless packages
NALLA RAVI K30 citations91
US8507324B2Aug 13, 2013
Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages
NALLA RAVI K2 citations61
US8896116B2Nov 25, 2014
Microelectronic package and method of manufacturing same
NALLA RAVI K0 citations51