Inventor

GOLLER BERND

DE32 patents

⚠️ This page may combine multiple inventors who share the name “GOLLER BERND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GOLLER BERND

INFINEON TECHNOLOGIES AG

Electronic component embedded within a plastic compound and including copper columns within the plastic compound extending between upper and lower rewiring layers, and system carrier and panel for producing an electronic component

Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device

Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component

Smart card, smart card module, and a method for production of a smart card module

Electronic component with a plastic package and method for production

Universal package for an electronic component with a semiconductor chip and method for producing the universal package

Electronic component and process for producing the electronic component

MEMS-sensor

Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds

Leadframe having mold lock vent

MEMS assembly and method for producing a MEMS assembly

Semiconductor package with mold lock vent

MEMS assembly

Semiconductor package with a through port for sensor applications

Method for producing a semiconductor module

Apparatus for determining a characteristic of a fluid having a device configured to measure a hydrodynamic pressure of the fluid

Sensor component and panel used for the production thereof

Electronic component and a panel

Electronic module having plug contacts and method for producing it

Semiconductor module

Semiconductor wafer with electrically connected contact and test areas

Device package with reduced radio frequency losses

Semiconductor structure integrated under a pad

Semiconductor wafer, panel and electronic component with stacked semiconductor chips, and also method for producing same

Apparatus with a high heat capacity and method for producing the same

Electronic component with at least one semiconductor chip and method for its manufacture

Methods of environmental protection for silicon MEMS structures in cavity packages

Package with vertical interconnect between carrier and clip

VOSS ARMATUREN

Plug-in connector for a pressure pipe system

GOLLER BERND

Method of fabricating a semiconductor package with mold lock opening

SIEMENS AG

Biosensor with smart card configuration

WERNER ERTLE

Semiconductor wafer with electrically connected contact and test areas