Inventor
LEDUTKE MICHAEL
DE8 patents
Patents
8 patentsUS10128165B2Nov 13, 2018
Package with vertically spaced partially encapsulated contact structures
INFINEON TECHNOLOGIES AG11 citations82
US10435292B2Oct 8, 2019
Method for producing a semiconductor module
INFINEON TECHNOLOGIES AG2 citations71
US9698070B2Jul 4, 2017
Arrangement having a plurality of chips and a chip carrier, and a processing arrangement
INFINEON TECHNOLOGIES AG2 citations71
US11040872B2Jun 22, 2021
Semiconductor module
INFINEON TECHNOLOGIES AG0 citations61
US12062589B2Aug 13, 2024
Semiconductor packages including recesses to contain solder
INFINEON TECHNOLOGIES AG0 citations58
US10923364B2Feb 16, 2021
Methods for producing packaged semiconductor devices
INFINEON TECHNOLOGIES AG0 citations54
US10361138B2Jul 23, 2019
Method for manufacturing an arrangement including a chip carrier notch
INFINEON TECHNOLOGIES AG0 citations50
US9202753B2Dec 1, 2015
Semiconductor devices and methods of producing these
INFINEON TECHNOLOGIES AG1 citations46