Inventor
ANG CHENG-LAY
SG3 patents
Patents
3 patentsUS9911890B2Mar 6, 2018
Optical sensor package including a cavity formed in an image sensor die
ST MICROELECTRONICS PTE LTD14 citations86
US10347786B2Jul 9, 2019
Optical sensor package including a cavity formed in an image sensor die
ST MICROELECTRONICS PTE LTD2 citations66
US10749067B2Aug 18, 2020
Optical sensor package including a cavity formed in an image sensor die
ST MICROELECTRONICS PTE LTD0 citations45