Inventor

PARK HEUNG WOO

KR26 patents

⚠️ This page may combine multiple inventors who share the name “PARK HEUNG WOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK HEUNG WOO

SAMSUNG ELECTRO MECH

Optical modulator module package using flip-chip mounting technology

Semiconductor package using flip-chip mounting technique

Embedded integrated circuit packaging structure

Electronic module and method of manufacturing the same

Miniature optical modulator module using flexible printed circuit board

Semi-conductor chip package capable of detecting open and short

Image sensor assembly, method of manufacturing the same, and camera module

Microphone package and mounting structure thereof

Micro-electro-mechanical system (MEMS) package with side sealing member and method of manufacturing the same

Micro electro mechanical systems sensor module package and method of manufacturing the same

Image sensor assembly, method of manufacturing the same, and camera module

Optical modulator module package

Light modulator package having inclined light transmissive lid

Electronic module and method of manufacturing the same

Electronic module and method of manufacturing the same

KIM JONG WOON

Inertial sensor and method of manufacturing the same

Inertial sensor and angular velocity detection method using the same

Inertial sensor

Inertial sensor

XIA TAI XIN SEMICONDUCTOR QING DAO LTD

Ion implantation apparatus

Cathode for ion source comprising a tapered sidewall

JEUNG WON KYU

Micro electro mechanical systems component

KOREA ELECTRONICS TELECOMM

Wavelength stabilization module having light-receiving element array and method of manufacturing the same

PARK JUNG TAE

Sensor capable of measuring acceleration, angular velocity, and DC acceleration

PARK HEUNG WOO

Polling method of piezoelectric element and method of manufacturing inertial sensor

LEE HYUN KEE

Method of manufacturing inertial sensor