Inventor
Wei cheng-hong
TW11 patents
Patents
11 patentsUS10685883B1Jun 16, 2020
Method of wafer dicing and die
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US10515853B1Dec 24, 2019
Method of wafer dicing
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US11778932B2Oct 3, 2023
Resistive random access memory and manufacturing method thereof
WINBOND ELECTRONICS CORP2 citations71
US12193344B2Jan 7, 2025
Method for manufacturing resistive random access memory
WINBOND ELECTRONICS CORP0 citations60
US11764274B2Sep 19, 2023
Memory device having contact plugs with narrower and wider portions
WINBOND ELECTRONICS CORP0 citations60
US11056564B2Jul 6, 2021
Method of manufacturing a memory device
WINBOND ELECTRONICS CORP0 citations60
US11978768B2May 7, 2024
Manufacturing method of semiconductor structure
WINBOND ELECTRONICS CORP0 citations56
US11721720B2Aug 8, 2023
Semiconductor structure
WINBOND ELECTRONICS CORP0 citations56
US10957594B2Mar 23, 2021
Manufacturing method of semiconductor chip
WINBOND ELECTRONICS CORP0 citations50
US12336175B2Jun 17, 2025
Memory device and method of manufacturing the same
WINBOND ELECTRONICS CORP0 citations49
US12027422B2Jul 2, 2024
Semiconductor structures and methods for forming the same
WINBOND ELECTRONICS CORP0 citations48