Inventor
DUBOIS GERAUD J M
US3 patents
Patents
3 patentsUS8841770B2Sep 23, 2014
Semiconductor interconnect structure having enhanced performance and reliability
IBM2 citations61
US11174412B2Nov 16, 2021
Surface modification by polymer anchoring on porous substrates
IBM0 citations59
US10370556B2Aug 6, 2019
Surface modification by polymer anchoring on porous substrates
IBM0 citations49