Inventor
KITAJIMA MASAYUKI
JP32 patents
⚠️ This page may combine multiple inventors who share the name “KITAJIMA MASAYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUJITSU LTD
26 patentsUS6184475B1Feb 6, 2001
Lead-free solder composition with Bi, In and Sn
FUJITSU LTD64 citations94
US6653761B2Nov 25, 2003
Micro-actuator and method of producing the same
FUJITSU LTD22 citations92
US6344690B1Feb 5, 2002
Semiconductor device with gold bumps, and method and apparatus of producing the same
FUJITSU LTD15 citations92
US6333554B1Dec 25, 2001
Semiconductor device with gold bumps, and method and apparatus of producing the same
FUJITSU LTD15 citations92
US6107181AAug 22, 2000
Method of forming bumps and template used for forming bumps
FUJITSU LTD17 citations92
US6521176B2Feb 18, 2003
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
FUJITSU LTD20 citations90
US6361626B1Mar 26, 2002
Solder alloy and soldered bond
FUJITSU LTD19 citations90
US6541898B2Apr 1, 2003
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method
FUJITSU LTD14 citations83
US6495441B2Dec 17, 2002
Semiconductor device with gold bumps, and method and apparatus of producing the same
FUJITSU LTD12 citations81
US6428911B2Aug 6, 2002
Soldering method and soldered joint
FUJITSU LTD15 citations79
US9615464B2Apr 4, 2017
Method of mounting semiconductor element, and semiconductor device
FUJITSU LTD4 citations73
US6984254B2Jan 10, 2006
Lead-free solder alloy and a manufacturing process of electric and electronic apparatuses using such a lead-free solder alloy
FUJITSU LTD5 citations73
US6848154B2Feb 1, 2005
Method of producing a micro-actuator
FUJITSU LTD8 citations73
US6786385B1Sep 7, 2004
Semiconductor device with gold bumps, and method and apparatus of producing the same
FUJITSU LTD6 citations73
US6596094B2Jul 22, 2003
Solder paste and electronic device
FUJITSU LTD7 citations73
US6467141B2Oct 22, 2002
Method of assembling micro-actuator
FUJITSU LTD12 citations73
US6744183B2Jun 1, 2004
Method of bonding piezoelectric element and electrode, and piezoelectric microactuator using the bonding method
FUJITSU LTD2 citations62
US6432806B1Aug 13, 2002
Method of forming bumps and template used for forming bumps
FUJITSU LTD2 citations62
US6893512B2May 17, 2005
Solder alloy and soldered bond
FUJITSU LTD5 citations61
US6320158B1Nov 20, 2001
Method and apparatus of fabricating perforated plate
FUJITSU LTD5 citations61
US7565739B2Jul 28, 2009
Method of making zinc-aluminum alloy connection
FUJITSU LTD5 citations60
US7425765B2Sep 16, 2008
Zinc-aluminum solder alloy
FUJITSU LTD3 citations60
US9195003B2Nov 24, 2015
Optical unit in which optical element is mounted on base having optical wave guide and method of manufacturing the same
FUJITSU LTD0 citations52
US10989743B2Apr 27, 2021
Power-demand-value calculating system, power-demand-value calculating method, and recording medium recording power-demand-value calculating program
FUJITSU LTD0 citations51
US9053262B2Jun 9, 2015
Method of determining reinforcement position of circuit substrate and substrate assembly
FUJITSU LTD0 citations51
US7356894B2Apr 15, 2008
Method of producing a micro-actuator
FUJITSU LTD0 citations51