Inventor

MASTER RAJ N

US47 patents

⚠️ This page may combine multiple inventors who share the name “MASTER RAJ N”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MASTER RAJ N

ADVANCED MICRO DEVICES INC

Organic pin grid array flip chip carrier package

Method to reduce occurrences of fillet cracking in flip-chip underfill

Void reduction in indium thermal interface material

Flux cleaning for flip chip technology using environmentally friendly solvents

No clean flux for flip chip assembly

Solder reflow furnace with flux effluent collector and method of preventing flux contamination

Method of preventing residue contamination of semiconductor devices during furnace processing

Reduction of damage to thermal interface material due to asymmetrical load

Void reduction in indium thermal interface material

Minimizing flux residue by controlling amount of moisture during reflow

Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps

Determination of flux prior to package assembly

Method of reflowing organic packages using no-clean flux

Pattern-block flux deposition

Process of ensuring detect free placement by solder coating on package pads

Boat for cleaning ball grid array packages

Method of fabricating reliable laminate flip-chip assembly

Boat for land grid array packages

Detection of flux residue

Semiconductor chip with solder joint protection ring

Automated brush fluxing system for application of controlled amount of flux to packages

Controlled and programmed deposition of flux on a flip-chip die by spraying

Boat for organic and ceramic flip chip package assembly

Boat for cleaning ball grid array packages

Organic packages having low tin solder connections

Lead-free semiconductor package

IBM

Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors

Method of making multilayered ceramic structures having an internal distribution of copper-based conductors

Process for flattening glass-ceramic substrates

In-situ device removal for multi-chip modules

Structure for repairing electrical lines

Method and structure for repairing electrical lines

Method for removal of carbonaceous residues from ceramic structures having internal metallurgy

Hot vacuum device removal process and apparatus

Bonding of pure metal films to ceramics

Method of controlling the sintering of metal particles

Method of controlling the sintering of metal particles

Process for braze attachment of electronic package members

Material and process set for fabrication of molecular matrix print head

Method of forming an adherent layer of metallurgy on a ceramic substrate

MICROSOFT CORP

Metal alloy injection molding protrusions

Metal alloy injection molding overflows

Metal alloy injection molding

Metal alloy injection molding protrusions

MICROSOFT TECHNOLOGY LICENSING LLC

Graphic formation via material ablation

TOO SEAH SUN

Integrated circuit socket

GLOBALFOUNDRIES INC

Method for forming solder joints for a flip chip assembly