P

Inventor

HSU YEH-CHI

TW10 patents
⚠️ This page may combine multiple inventors who share the name “HSU YEH-CHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHANG WEN-YUAN

3 patents
US9418964B2Aug 16, 2016

Chip package structure

CHANG WEN-YUAN13 citations82
US8698325B2Apr 15, 2014

Integrated circuit package and physical layer interface arrangement

CHANG WEN-YUAN2 citations60
US8796848B2Aug 5, 2014

Circuit board and chip package structure

CHANG WEN-YUAN0 citations51

SHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD

2 patents
US10504847B2Dec 10, 2019

Chip package structure and chip package structure array

SHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD14 citations84
US10756077B2Aug 25, 2020

Chip packaging method

SHANGHAI ZHAOXIN SEMICONDUCTOR CO LTD0 citations40

VIA ALLIANCE SEMICONDUCTOR CO LTD

2 patents
US10204852B2Feb 12, 2019

Circuit substrate and semiconductor package structure

VIA ALLIANCE SEMICONDUCTOR CO LTD8 citations82
US9601425B2Mar 21, 2017

Circuit substrate and semiconductor package structure

VIA ALLIANCE SEMICONDUCTOR CO LTD0 citations51

VIA TECH INC

2 patents
US7906377B2Mar 15, 2011

Fabrication method of circuit board

VIA TECH INC3 citations62
US12506060B2Dec 23, 2025

Package substrate, chip package and integrated circuit chip

VIA TECH INC0 citations44

CHEN YU-KAI

1 patent
US8736079B2May 27, 2014

Pad structure, circuit carrier and integrated circuit chip

CHEN YU-KAI5 citations69