Inventor
LAURO PAUL ALFRED
US44 patents
⚠️ This page may combine multiple inventors who share the name “LAURO PAUL ALFRED”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
38 patentsUS7538565B1May 26, 2009
High density integrated circuit apparatus, test probe and methods of use thereof
IBM112 citations99
US7495342B2Feb 24, 2009
Angled flying lead wire bonding process
IBM109 citations99
US6708403B2Mar 23, 2004
Angled flying lead wire bonding process
IBM194 citations99
US6528984B2Mar 4, 2003
Integrated compliant probe for wafer level test and burn-in
IBM178 citations99
US6526655B2Mar 4, 2003
Angled flying lead wire bonding process
IBM188 citations99
US6452406B1Sep 17, 2002
Probe structure having a plurality of discrete insulated probe tips
IBM111 citations99
US6334247B1Jan 1, 2002
High density integrated circuit apparatus, test probe and methods of use thereof
IBM277 citations99
US6332270B2Dec 25, 2001
Method of making high density integral test probe
IBM231 citations99
US6300780B1Oct 9, 2001
High density integrated circuit apparatus, test probe and methods of use thereof
IBM197 citations99
US6295729B1Oct 2, 2001
Angled flying lead wire bonding process
IBM206 citations99
US6206273B1Mar 27, 2001
Structures and processes to create a desired probetip contact geometry on a wafer test probe
IBM206 citations99
US6062879AMay 16, 2000
High density test probe with rigid surface structure
IBM150 citations99
US5821763AOct 13, 1998
Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof
IBM349 citations99
US5785538AJul 28, 1998
High density test probe with rigid surface structure
IBM147 citations99
US6722032B2Apr 20, 2004
Method of forming a structure for electronic devices contact locations
IBM79 citations98
US6329827B1Dec 11, 2001
High density cantilevered probe for electronic devices
IBM107 citations98
US6078500AJun 20, 2000
Pluggable chip scale package
IBM149 citations98
US6054651AApr 25, 2000
Foamed elastomers for wafer probing applications and interposer connectors
IBM128 citations98
US5914614AJun 22, 1999
High density cantilevered probe for electronic devices
IBM130 citations98
US5838160ANov 17, 1998
Integral rigid chip test probe
IBM99 citations98
US5811982ASep 22, 1998
High density cantilevered probe for electronic devices
IBM310 citations97
US6104201AAug 15, 2000
Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage
IBM82 citations96
US6523255B2Feb 25, 2003
Process and structure to repair damaged probes mounted on a space transformer
IBM20 citations93
US7417315B2Aug 26, 2008
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
IBM12 citations92
US7368924B2May 6, 2008
Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
IBM34 citations92
US7276919B1Oct 2, 2007
High density integral test probe
IBM35 citations92
US6891360B1May 10, 2005
Plated probe structure
IBM22 citations92
US6525551B1Feb 25, 2003
Probe structures for testing electrical interconnections to integrated circuit electronic devices
IBM31 citations92
US7282945B1Oct 16, 2007
Wafer scale high density probe assembly, apparatus for use thereof and methods of fabrication thereof
IBM7 citations74
US11541472B2Jan 3, 2023
Ultrasonic-assisted solder transfer
IBM0 citations63
US7906420B2Mar 15, 2011
Method and apparatus for forming planar alloy deposits on a substrate
IBM5 citations63
US7867842B2Jan 11, 2011
Method and apparatus for forming planar alloy deposits on a substrate
IBM3 citations63
US7556979B2Jul 7, 2009
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer composites and conductive elastomer interconnects in microelectronic packaging
IBM1 citations63
US7332922B2Feb 19, 2008
Method for fabricating a structure for making contact with a device
IBM2 citations63
US6880245B2Apr 19, 2005
Method for fabricating a structure for making contact with an IC device
IBM4 citations63
US11270966B2Mar 8, 2022
Combination polyimide decal with a rigid mold
IBM0 citations52
US11110534B2Sep 7, 2021
Continuous solder transfer to substrates
IBM0 citations52
US7883919B2Feb 8, 2011
Negative thermal expansion system (NTEs) device for TCE compensation in elastomer compsites and conductive elastomer interconnects in microelectronic packaging
IBM0 citations52
BEAMAN BRIAN SAMUEL
3 patentsUS8486250B2Jul 16, 2013
Electrodeposition method of forming a probe structure having a plurality of discrete insulated probe tips projecting from a support surface
BEAMAN BRIAN SAMUEL2 citations61
US8754666B2Jun 17, 2014
Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof
BEAMAN BRIAN SAMUEL0 citations51
US8491772B2Jul 23, 2013
Redox method of forming a coaxial probe structure of elongated electrical conductors projecting from a support structure
BEAMAN BRIAN SAMUEL0 citations51