Inventor

SHIH DA-YUAN

US120 patents

⚠️ This page may combine multiple inventors who share the name “SHIH DA-YUAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHIH DA-YUAN

IBM

High density integrated circuit apparatus, test probe and methods of use thereof

Angled flying lead wire bonding process

Angled flying lead wire bonding process

Angled flying lead wire bonding process

Integrated compliant probe for wafer level test and burn-in

Probe structure having a plurality of discrete insulated probe tips

High density integrated circuit apparatus, test probe and methods of use thereof

Method of making high density integral test probe

High density integrated circuit apparatus, test probe and methods of use thereof

Angled flying lead wire bonding process

Structures and processes to create a desired probetip contact geometry on a wafer test probe

High density test probe with rigid surface structure

Adhesion promoting layer for bonding polymeric adhesive to metal and a heat sink assembly using same

Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof

High density test probe with rigid surface structure

Process for making a foamed polymer

Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer

Three dimensional high performance interconnection package

Cooling apparatus with cold plate formed in situ on a surface to be cooled

Thermal interposer for thermal management of semiconductor devices

Thermal interposer for thermal management of semiconductor devices

Method of forming a structure for electronic devices contact locations

High density cantilevered probe for electronic devices

Pluggable chip scale package

Foamed elastomers for wafer probing applications and interposer connectors

High density cantilevered probe for electronic devices

Integral rigid chip test probe

Process for making a foamed elastomeric polymer

Electronic devices comprising dielectric foamed polymers

Process for making a foamed elastometric polymer

Method of forming a three dimensional high performance interconnection package

Interconnector with contact pads having enhanced durability

Interconnector with contact pads having enhanced durability

Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage

Process of making pinless connector

Flex circuit card elastomeric cable connector assembly

Flex circuit card elastomeric cable connector assembly

Lead-free tin-silver-copper alloy solder composition

Semiconductor structure with solder bumps

Electrical interconnect structure and method

Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled

Patterned metal thermal interface

Injection molded microoptics

Process and structure to repair damaged probes mounted on a space transformer

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Probe structure having a plurality of discrete insulated probe tips projecting from a support surface, apparatus for use thereof and methods of fabrication thereof

YU CHUN HUI

Multi-chip wafer level package

NAH JAE-WOONG

Copper post solder bumps on substrate

SHAO TUNG-LIANG

Apparatus and methods for forming through vias

YU CHEN-HUA

Joint structure for substrates and methods of forming