Inventor
WALKER GEORGE FREDERICK
US27 patents
⚠️ This page may combine multiple inventors who share the name “WALKER GEORGE FREDERICK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
25 patentsUS7538565B1May 26, 2009
High density integrated circuit apparatus, test probe and methods of use thereof
IBM112 citations99
US6334247B1Jan 1, 2002
High density integrated circuit apparatus, test probe and methods of use thereof
IBM277 citations99
US6332270B2Dec 25, 2001
Method of making high density integral test probe
IBM231 citations99
US6300780B1Oct 9, 2001
High density integrated circuit apparatus, test probe and methods of use thereof
IBM197 citations99
US5821763AOct 13, 1998
Test probe for high density integrated circuits, methods of fabrication thereof and methods of use thereof
IBM349 citations99
US5838160ANov 17, 1998
Integral rigid chip test probe
IBM99 citations98
US5682143AOct 28, 1997
Radio frequency identification tag
IBM557 citations98
US6323128B1Nov 27, 2001
Method for forming Co-W-P-Au films
IBM292 citations97
US7276787B2Oct 2, 2007
Silicon chip carrier with conductive through-vias and method for fabricating same
IBM124 citations96
US6104201AAug 15, 2000
Method and apparatus for passive characterization of semiconductor substrates subjected to high energy (MEV) ion implementation using high-injection surface photovoltage
IBM82 citations96
US5958590ASep 28, 1999
Dendritic powder materials for high conductivity paste applications
IBM72 citations96
US5837119ANov 17, 1998
Methods of fabricating dendritic powder materials for high conductivity paste applications
IBM60 citations96
US6351134B2Feb 26, 2002
Semiconductor wafer test and burn-in
IBM127 citations95
US6646345B2Nov 11, 2003
Method for forming Co-W-P-Au films
IBM45 citations94
US5813870ASep 29, 1998
Selectively filled adhesives for semiconductor chip interconnection and encapsulation
IBM55 citations94
US5929651AJul 27, 1999
Semiconductor wafer test and burn-in
IBM80 citations93
US7276919B1Oct 2, 2007
High density integral test probe
IBM35 citations92
US6819000B2Nov 16, 2004
High density area array solder microjoining interconnect structure and fabrication method
IBM28 citations92
US6732908B2May 11, 2004
High density raised stud microjoining system and methods of fabricating the same
IBM19 citations92
US6661098B2Dec 9, 2003
High density area array solder microjoining interconnect structure and fabrication method
IBM18 citations92
US5855993AJan 5, 1999
Electronic devices having metallurgies containing copper-semiconductor compounds
IBM49 citations89
US6414509B1Jul 2, 2002
Method and apparatus for in-situ testing of integrated circuit chips
IBM18 citations79
US6747472B2Jun 8, 2004
Temporary device attach structure for test and burn in of microjoint interconnects and method for fabricating the same
IBM8 citations72
US5660921AAug 26, 1997
Poly (aryl ether benzimidazoles) their use capping layers in microelectronic structures
IBM4 citations69
US7880305B2Feb 1, 2011
Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer
IBM0 citations42