P

Inventor

FORTIER PAUL F

CA26 patents
⚠️ This page may combine multiple inventors who share the name “FORTIER PAUL F”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

24 patents
US6712527B1Mar 30, 2004

Fiber optic connections and method for using same

IBM100 citations97
US9568682B1Feb 14, 2017

Component and chip assembly structure for high yield parallelized fiber assembly

IBM20 citations91
US6547452B1Apr 15, 2003

Alignment systems for subassemblies of overmolded optoelectronic modules

IBM22 citations89
US9360644B2Jun 7, 2016

Laser die and photonics die package

IBM14 citations84
US9316796B2Apr 19, 2016

Fiber pigtail with integrated lid

IBM7 citations84
US10613282B2Apr 7, 2020

Fluid control structure

IBM8 citations83
US9989713B1Jun 5, 2018

Fluid control structure

IBM8 citations83
US9958625B2May 1, 2018

Structured substrate for optical fiber alignment

IBM2 citations73
US9671578B2Jun 6, 2017

Structured substrate for optical fiber alignment

IBM2 citations73
US9658415B2May 23, 2017

Structured substrate for optical fiber alignment

IBM2 citations73
US9246592B2Jan 26, 2016

Structured substrate for optical fiber alignment

IBM3 citations73
US10371907B2Aug 6, 2019

Fluid control structure

IBM2 citations72
US9651747B1May 16, 2017

Fiber pigtail assembly with integrated lid enabling optical fiber mobility

IBM2 citations72
US6652159B2Nov 25, 2003

Enhanced optical transceiver arrangement

IBM7 citations72
US9897444B2Feb 20, 2018

Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect

IBM2 citations68
US9400356B2Jul 26, 2016

Fiber pigtail with integrated lid

IBM2 citations63
US10969222B2Apr 6, 2021

Measurements of an integrated circuit chip and connected chip carrier to estimate height of interconnect

IBM0 citations58
US9810864B2Nov 7, 2017

Fiber pigtail assembly with integrated lid enabling optical fiber mobility

IBM1 citations51
US9759868B2Sep 12, 2017

Structures for preventing dicing damage

IBM0 citations51
US9701872B2Jul 11, 2017

Picktip having non-planar topography

IBM0 citations50
US9243784B2Jan 26, 2016

Semiconductor photonic package

IBM1 citations49
US9206965B2Dec 8, 2015

Semiconductor photonic package

IBM1 citations49
US10539743B2Jan 21, 2020

Fiber attach assembly and test automation

IBM0 citations48
US9684133B2Jun 20, 2017

Component assembly apparatus

IBM0 citations36

JDS UNIPHASE CORP

1 patent

BLAIS PASCAL P

1 patent