Inventor
SONG KEVIN H
US4 patents
Patents
4 patentsUS7199056B2Apr 3, 2007
Low cost and low dishing slurry for polysilicon CMP
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Substrate polish edge uniformity control with secondary fluid dispense
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Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer
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US12090600B2Sep 17, 2024
Face-up wafer electrochemical planarization apparatus
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