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Inventor
BINTI ZUKIFFLY ZURINA
MY
2 patents
Patents
2 patents
US8164182B2
Apr 24, 2012
Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip
ONG YOU YANG
9 citations
76
US8415786B2
Apr 9, 2013
Thermally enhanced semiconductor package system
ONG YOU YANG
0 citations
44