Inventor

BIN EMBONG SAAT SHUKRI

MY2 patents

Patents

2 patents

US8164182B2Apr 24, 2012

Hyper thermally enhanced semiconductor package system comprising heat slugs on opposite surfaces of a semiconductor chip

ONG YOU YANG9 citations76

US8415786B2Apr 9, 2013

Thermally enhanced semiconductor package system

ONG YOU YANG0 citations44