Inventor

DANGELMAIER JOCHEN

DE48 patents

⚠️ This page may combine multiple inventors who share the name “DANGELMAIER JOCHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

DANGELMAIER JOCHEN

INFINEON TECHNOLOGIES AG

Integrated magnetic sensor component

Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier

Radiofrequency power semiconductor module with cavity housing, and method for producing it

Device and method for data transmission between structural units connected by an articulated joint

Component with chip through-contacts

Semiconductor sensor device with sensor chip and method for producing the same

Semiconductor module provided with contacts extending through the package

Flexible rewiring plate for semiconductor components, and process for producing it

Pressure sensor package having a stacked die arrangement

Method for manufacturing a housing for a chip having a micromechanical structure

Current sensor

Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery

Semiconductor sensor device and method for fabricating the same

Sensor arrangement, battery cell and energy system

Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer

Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact

Direct selective adhesion promotor plating

Package comprising identifier on and/or in carrier

Electronic device and method of manufacturing same

Semiconductor device with surface-mountable external contacts and method for manufacturing the same

Semiconductor device for radio frequencies of more than 10 GHz and method for producing the device

Photoacoustic sensors and MEMS devices

Current sensor that includes a current rail and a magnetic field sensor with galvanic isolation

Microelectromechanical system (MEMS) sensor packages and methods for producing microelectromechanical system sensor packages having a plurality of MEMS sensor chips

Photoacoustic sensors and MEMS devices

Chip package, method of forming a chip package and method of forming an electrical contact

Optocoupler for converting optical signals into electrical signals and vice versa

Connector module and method of manufacturing the same

Direct selective adhesion promotor plating

Ultrasonic touch sensor

Package with selective corrosion protection of electric connection structure

Current sensor device with a routable molded lead frame

Current sensor device

Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof

Micro-optical module with housing and method for producing the same

Method for producing a component and device comprising a component

Process for producing and apparatus for improving the bonding between a plastic and a metal

Chip carrier and system including a chip carrier and semiconductor chips

Pre-mold for a microphone assembly and method of producing the same

Semiconductor device with gold coatings, and process for producing it

Direct selective adhesion promotor plating

Molded lead frame sensor package

Semiconductor component and apparatus for production of a semiconductor component

THEUSS HORST

Module including a micro-electro-mechanical microphone

Method for producing a component and device having a component

INFINEON TECHNOLOIGES AG

Semiconductor component having a plastic housing and methods for its production

AVAGO TECH FIBER IP SG PTE LTD

MID module and a method of mounting an optical fibre in an MID module

EWE HENRIK

Semiconductor device