Inventor
CRAIG DAVID M
US12 patents
⚠️ This page may combine multiple inventors who share the name “CRAIG DAVID M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HEWLETT PACKARD DEVELOPMENT CO
8 patentsUS7576439B2Aug 18, 2009
Electrically connecting substrate with electrical device
HEWLETT PACKARD DEVELOPMENT CO109 citations97
US7476608B2Jan 13, 2009
Electrically connecting substrate with electrical device
HEWLETT PACKARD DEVELOPMENT CO105 citations97
US7307773B2Dec 11, 2007
Micro-optoelectromechanical system packages for a light modulator and methods of making the same
HEWLETT PACKARD DEVELOPMENT CO10 citations84
US6917099B2Jul 12, 2005
Die carrier with fluid chamber
HEWLETT PACKARD DEVELOPMENT CO13 citations82
US7300812B2Nov 27, 2007
Micro electrical mechanical system
HEWLETT PACKARD DEVELOPMENT CO8 citations73
US7262498B2Aug 28, 2007
Assembly with a ring and bonding pads formed of a same material on a substrate
HEWLETT PACKARD DEVELOPMENT CO2 citations62
US7019886B2Mar 28, 2006
Light modulator
HEWLETT PACKARD DEVELOPMENT CO4 citations62
US7541209B2Jun 2, 2009
Method of forming a device package having edge interconnect pad
HEWLETT PACKARD DEVELOPMENT CO1 citations52
INTEL CORP
3 patentsUS11527501B1Dec 13, 2022
Sacrificial redistribution layer in microelectronic assemblies having direct bonding
INTEL CORP7 citations83
US11749628B2Sep 5, 2023
Sacrificial redistribution layer in microelectronic assemblies having direct bonding
INTEL CORP0 citations59
US9977054B2May 22, 2018
Etching for probe wire tips for microelectronic device test
INTEL CORP1 citations49