Inventor · disambiguated record
John Brennan
Also filed as: BRENNAN JOHN · BRENNAN JOHN M · BRENNAN JOHN MCKENNA
20 granted patents·6 pending applications·461 citations·filing 1978–2018
95Inventor score
Top patents by PatentIndex Score
26 records- 0185US7443042B2Methods and apparatus for wire bonding with wire length adjustment in an integrated circuitAGERE SYSTEMS INC·Filed 2006·Granted Oct 28, 2008·11 cites·4 claims
- 0282US5572704ASystem and method for controlling split-level caches in a multi-processor system including data loss and deadlock prevention schemesSILICON GRAPHICS INC·Filed 1993·Granted Nov 5, 1996·91 cites·14 claims
- 0382US4238092AAccessory for a turbine engineROHR INDUSTRIES INC·Filed 1978·Granted Dec 9, 1980·44 cites·2 claims
- 0479US5510934AMemory system including local and global caches for storing floating point and integer dataSILICON GRAPHICS INC·Filed 1993·Granted Apr 23, 1996·87 cites·5 claims
- 0578US5632025AMethod for preventing multi-level cache system deadlock in a multi-processor systemSILICON GRAPHICS INC·Filed 1996·Granted May 20, 1997·82 cites·3 claims
- 0673US9533740B2Adaptable modular power system (AMPS)LIQUID ROBOTICS INC·Filed 2014·Granted Jan 3, 2017·4 cites·20 claims
- 0772US4348754ADigital delay for high quality audio useAMPEX·Filed 1980·Granted Sep 7, 1982·19 cites·5 claims
- 0871US5537538ADebug mode for a superscalar RISC processorSILICON GRAPHICS INC·Filed 1993·Granted Jul 16, 1996·58 cites·4 claims
- 0969US7214568B2Semiconductor device configured for reducing post-fabrication damageAGERE SYSTEMS INC·Filed 2004·Granted May 8, 2007·14 cites·23 claims
- 1065US7637414B2Methods and apparatus for wire bonding with wire length adjustment in an integrated circuitAGERE SYSTEMS INC·Filed 2008·Granted Dec 29, 2009·2 cites·20 claims
- 1158US7465655B2Integrated circuit with substantially perpendicular wire bondsAGERE SYSTEMS INC·Filed 2006·Granted Dec 16, 2008·1 cites·14 claims
- 1258US7164200B2Techniques for reducing bowing in power transistor devicesAGERE SYSTEMS INC·Filed 2004·Granted Jan 16, 2007·7 cites·20 claims
- 1356US10005535B2Adaptable modular power system (AMPS) and dedicated connector; modular payload boxes and autonomous water vehicle configured to accept sameLIQUID ROBOTICS INC·Filed 2014·Granted Jun 26, 2018·1 cites·20 claims
- 1452US6829666B1Modular computing architecture having common communication interfaceSILICON GRAPHICS INC·Filed 1999·Granted Dec 7, 2004·30 cites·25 claims
- 1551US10913523B2Adaptable modular power system (AMPS) and dedicated connector; modular payload boxes and autonomous water vehicle configured to accept sameLIQUID ROBOTICS INC·Filed 2018·Granted Feb 9, 2021·0 cites·20 claims
- 1650US7086148B2Methods and apparatus for wire bonding with wire length adjustment in an integrated circuitAGERE SYSTEMS INC·Filed 2004·Granted Aug 8, 2006·3 cites·17 claims
- 1749US7109589B2Integrated circuit with substantially perpendicular wire bondsAGERE SYSTEMS INC·Filed 2004·Granted Sep 19, 2006·3 cites·12 claims
- 1849US7075174B2Semiconductor packaging techniques for use with non-ceramic packagesAGERE SYSTEMS INC·Filed 2004·Granted Jul 11, 2006·4 cites·20 claims
- 1946US2015025369A1Housing for the oct probe, oct probe assembly, and a method of making such assemblyCORNING INC·Filed 2014·Application pending·0 cites
- 2041US2013215924A1Non-hermetic, multi-emitter laser pump packages and methods for forming the sameBRENNAN JOHN MCKENNA·Filed 2013·Application pending·0 cites
- 2140US7242090B2Device packageAGERE SYSTEMS INC·Filed 2005·Granted Jul 10, 2007·0 cites·20 claims
- 2238US7235422B2Device packagesAGERE SYSTEMS INC·Filed 2005·Granted Jun 26, 2007·0 cites·7 claims
- 2338US2006108672A1Die bonded device and method for transistor packagesBRENNAN JOHN M·Filed 2004·Application pending·0 cites
- 2438US2006170079A1Integrated circuit device having encapsulant dam with chamfered edgeBRENNAN JOHN M·Filed 2005·Application pending·0 cites
- 2537US2006145317A1Leadframe designs for plastic cavity transistor packagesBRENNAN JOHN M·Filed 2004·Application pending·0 cites
- 2632US2005184385A1Semiconductor device with improved thermal characteristicsFiled 2004·Application pending·0 cites
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