Inventor
TEO YONG CHUA
SG3 patents
Patents
3 patentsUS6424047B1Jul 23, 2002
Plastic ball grid array package for passing JEDEC Level 1 Moisture Sensitivity Test
INST OF MICROELECTRONICS23 citations86
US6621151B1Sep 16, 2003
Lead frame for an integrated circuit chip
INST OF MICROELECTRONICS2 citations57
US6583501B2Jun 24, 2003
Lead frame for an integrated circuit chip (integrated circuit peripheral support)
INST OF MICROELECTRONICS0 citations45