Inventor
PAN LING
CN20 patents
⚠️ This page may combine multiple inventors who share the name “PAN LING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
8 patentsUS12355167B2Jul 8, 2025
Connection designs for memory systems
MICRON TECHNOLOGY INC0 citations62
US12476216B2Nov 18, 2025
Wire bonding for stacked memory dies
MICRON TECHNOLOGY INC0 citations60
US12463140B2Nov 4, 2025
Flexible interposer for semiconductor dies
MICRON TECHNOLOGY INC0 citations60
US12506134B2Dec 23, 2025
Fan-out packaging for a multichip package
MICRON TECHNOLOGY INC0 citations58
US12368113B2Jul 22, 2025
Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices
MICRON TECHNOLOGY INC0 citations56
US11688662B2Jun 27, 2023
Thermal distribution network for semiconductor devices and associated systems and methods
MICRON TECHNOLOGY INC0 citations55
US12581976B2Mar 17, 2026
Wire bonding directly on exposed conductive vias and interconnects and related systems and methods
MICRON TECHNOLOGY INC0 citations51
US12412811B2Sep 9, 2025
Split via structure for semiconductor device packaging
MICRON TECHNOLOGY INC0 citations51
PAN LING
4 patentsCATERPILLAR INC
3 patentsUS11253956B2Feb 22, 2022
Structure having stress protected groove weld and structural members forming the same
CATERPILLAR INC0 citations56
US10981253B2Apr 20, 2021
Structure having stress protected groove weld and structural members forming the same
CATERPILLAR INC1 citations56
US10688600B2Jun 23, 2020
Structure having stress protected groove weld and structural members forming the same
CATERPILLAR INC1 citations56