Inventor
KAO FENG
TW7 patents
Patents
7 patentsUS12368116B2Jul 22, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations72
US11973047B2Apr 30, 2024
Electronic package including electronic structure and electronic component
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations70
US11152331B2Oct 19, 2021
Electronic package and method for fabricating the same
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations70
US12283560B2Apr 22, 2025
Electronic package including electronic structure and electronic body and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations61
US12009340B2Jun 11, 2024
Method for fabricating electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US12438079B2Oct 7, 2025
Electronic structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59
US11984393B2May 14, 2024
Electronic package, manufacturing method for the same, and electronic structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations59