Inventor
Gandhi Ramanathan
US25 patents
⚠️ This page may combine multiple inventors who share the name “Gandhi Ramanathan”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
22 patentsUS11658246B2May 23, 2023
Devices including vertical transistors, and related methods and electronic systems
MICRON TECHNOLOGY INC2 citations73
US11335788B2May 17, 2022
Semiconductor devices, transistors, and related methods for contacting metal oxide semiconductor devices
MICRON TECHNOLOGY INC3 citations73
US10629732B1Apr 21, 2020
Elevationally-extending transistors, devices comprising elevationally-extending transistors, and methods of forming a device comprising elevationally-extending transistors
MICRON TECHNOLOGY INC4 citations73
US12218236B2Feb 4, 2025
Devices including heterogeneous channels, and related memory devices, electronic systems, and methods
MICRON TECHNOLOGY INC0 citations62
US12199182B2Jan 14, 2025
Elevationally-extending transistors, devices comprising elevationally-extending transistors, and methods of forming a device comprising elevationally-extending transistors
MICRON TECHNOLOGY INC0 citations62
US12199183B2Jan 14, 2025
Memory devices including oxide semiconductor
MICRON TECHNOLOGY INC0 citations62
US12101946B2Sep 24, 2024
Integrated assemblies comprising hydrogen diffused within two or more different semiconductor materials, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11908913B2Feb 20, 2024
Semiconductor devices, transistors, and related methods for contacting metal oxide semiconductor devices
MICRON TECHNOLOGY INC0 citations62
US11832454B2Nov 28, 2023
Integrated assemblies comprising hydrogen diffused within two or more different semiconductor materials, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11695050B2Jul 4, 2023
Assemblies which include ruthenium-containing conductive gates
MICRON TECHNOLOGY INC0 citations62
US11527620B2Dec 13, 2022
Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material
MICRON TECHNOLOGY INC0 citations62
US11515417B2Nov 29, 2022
Transistors including heterogeneous channels
MICRON TECHNOLOGY INC1 citations62
US11437521B2Sep 6, 2022
Methods of forming a semiconductor device
MICRON TECHNOLOGY INC1 citations62
US11329133B2May 10, 2022
Integrated assemblies having semiconductor oxide channel material, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC1 citations62
US11152509B2Oct 19, 2021
Elevationally-extending transistors, devices comprising elevationally-extending transistors, and methods of forming a device comprising elevationally-extending transistors
MICRON TECHNOLOGY INC0 citations62
US11107817B2Aug 31, 2021
Integrated assemblies comprising hydrogen diffused within two or more different semiconductor materials, and methods of forming integrated assemblies
MICRON TECHNOLOGY INC0 citations62
US11038027B2Jun 15, 2021
Integrated assemblies having polycrystalline first semiconductor material adjacent conductively-doped second semiconductor material
MICRON TECHNOLOGY INC0 citations62
US10998440B2May 4, 2021
Device including a vertical transistor having a large band gap channel material and void spaces adjacent gate electrodes, and related methods and systems
MICRON TECHNOLOGY INC0 citations62
US10964793B2Mar 30, 2021
Assemblies which include ruthenium-containing conductive gates
MICRON TECHNOLOGY INC0 citations62
US11538919B2Dec 27, 2022
Transistors and arrays of elevationally-extending strings of memory cells
MICRON TECHNOLOGY INC0 citations60
US12133383B2Oct 29, 2024
Memory cell and method used in forming a memory cells
MICRON TECHNOLOGY INC0 citations54
US11856766B2Dec 26, 2023
Memory cell having programmable material comprising at least two regions comprising SiNx
MICRON TECHNOLOGY INC0 citations54