Inventor

ROH KWON-YOUNG

KR2 patents

Patents

2 patents

US6521990B2Feb 18, 2003

Ball grid array package comprising a heat sink

SAMSUNG ELECTRONICS CO LTD35 citations88

US7652367B2Jan 26, 2010

Semiconductor package on package having plug-socket type wire connection between packages

SAMSUNG ELECTRONICS CO LTD3 citations57