Inventor
HUANG ZENGBIAO
CN7 patents
Patents
7 patentsUS10240074B2Mar 26, 2019
Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods therefor
SHENGYI TECHNOLOGY CO LTD3 citations65
US11661378B2May 30, 2023
Boron nitride agglomerate, thermosetting resin composition containing same, and use thereof
SHENGYI TECHNOLOGY CO LTD1 citations57
US12378386B2Aug 5, 2025
Resin composition and application thereof
SHENGYI TECHNOLOGY CO LTD0 citations56
US12122904B2Oct 22, 2024
Thermosetting resin composition and prepreg, laminate and printed circuit board using same
SHENGYI TECHNOLOGY CO LTD0 citations54
US11732123B2Aug 22, 2023
Thermosetting resin composition, and prepreg, laminate and printed circuit board using same
SHENGYI TECHNOLOGY CO LTD0 citations54
US11649351B2May 16, 2023
Resin composition for a metal substrate, and resin varnish and metal base copper-clad laminate comprising the same
SHENGYI TECHNOLOGY CO LTD0 citations43
US10400058B2Sep 3, 2019
Degradable resin composition, and prepreg, laminate and copper clad laminate using same, and degrading method thereof
SHENGYI TECHNOLOGY CO LTD0 citations36