Inventor
PANG CHIEN-KEE
SG10 patents
Patents
10 patentsUS10580823B2Mar 3, 2020
Wafer level packaging method
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Method of manufacturing semiconductor device for reducing grain size of polysilicon
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Flash cell structure and method of fabricating the same
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US12266578B2Apr 1, 2025
Chips bonding auxiliary structure
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US11456221B2Sep 27, 2022
Method for measuring chips bonding strength and chips bonding auxiliary structure
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US12278210B2Apr 15, 2025
Manufacturing method of semiconductor structure
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US12249607B2Mar 11, 2025
Semiconductor structure
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US11605648B2Mar 14, 2023
Semiconductor structure and manufacturing method thereof
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US12419081B2Sep 16, 2025
Silicon-on-insulator substrate and method of manufacturing the same
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US10622253B2Apr 14, 2020
Manufacturing method of semiconductor device
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